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(IT-NEWSWIRE.COM, October 03, 2018 ) This report covers the present scenario (with the base year being 2017) and the growth prospects of global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market for 2018-2023. Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board. Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems. Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality. Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period. Over the next five years, this report projects that Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) will register a 1.9% CAGR in terms of revenue, reach US$ 25700 million by 2023, from US$ 23000 million in 2017. This report presents a comprehensive overview, market shares, and growth opportunities of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by product type, application, key manufacturers and key regions. To calculate the market size, this report considers value and volume generated from the sales of the following segments: Segmentation by product type: Layer 4-6 Layer 8-10 Layer 10+ Segmentation by application: Consumer Electronics Communications Computer Related Industry Automotive Industry Other This report also splits the market by region: Americas United States Canada Mexico Brazil APAC China Japan Korea Southeast Asia India Australia Europe Germany France UK Italy Russia Spain Middle East & Africa Egypt South Africa Israel Turkey GCC Countries The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Nippon Mektron ZD Tech TTM Technologies Unimicron Sumitomo Denko Compeq Tripod Samsung E-M Young Poong Group HannStar Ibiden Nanya PCB KBC PCB Group Daeduck Group AT&S Fujikura Meiko Multek Kinsus Chin Poon T.P.T. Shinko Denski Wus Group Simmtech Mflex CMK LG Innotek Gold Circuit Shennan Circuit Ellington Kinwong Founder Tech Dynamic Aoshikang Wuzhou CCTC SZ Fast Print Guangdong Xinda Shenzhen Suntak Redboard In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development. Research objectives To study and analyze the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023. To understand the structure of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by identifying its various subsegments. Focuses on the key global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years. To analyze the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) with respect to individual growth trends, future prospects, and their contribution to the total market. To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks). To project the consumption of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) submarkets, with respect to key regions (along with their respective key countries). To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market. To strategically profile the key players and comprehensively analyze their growth strategies.
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Contact Information: Madhuri Vetal NxtGen Reports Email: sales@nxtgenreports.com Phone: +918551022388 More Report at: https://www.nxtgenreports.com/market-research-reports
NxtGen Reports
Madhuri Vetal
+918551022388
sales@nxtgenreports.com
Source: EmailWire.Com
Source: EmailWire.com
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