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(IT-NEWSWIRE.COM, May 31, 2018 ) Asia-Pacific Electronics Adhesives Market is estimated to grow at a significantly high CAGR during the forecast period (2018 - 2023). China is expected to hold the largest share of the market, owing to the healthy growth of the automotive and electronics-based industries in the region. Asia-Pacific Electronics Adhesives Market-Segmented by Resin Type, Application and Geography-Growth, Trends and Forecast (2018-2023) provides a comprehensive assessment of the fast-evolving, high-growth Electronics Adhesives Market. The Report gives Forecasts with Competitive Landscape of the Leading Companies including Global Analysis of the Electronics Adhesives Market.
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Increasing Demand from Automotive Industries to Propel Market Growth
The electronics applications in the automotive industry includes airbags, anti-lock braking system, black box, adaptive cruise control, drive by wire, satellite radio, telematics, emission control, traction control, automatic parking, in-vehicle entertainment systems, night vision, head-up displays, back up collision sensors, navigational systems, tire pressure monitor, and climate control. High-end electronics are being used in automotive vehicles to provide the drivers and passengers with in-car navigation, entertainment, and information.
The foreign and domestic players share the traditional Chinese automotive market. The emergence of New Energy Vehicles (NEV) has seen the domestic players having an upper hand over the foreign players. The advent of these NEVs will ensure significant growth in the automotive sector of the country during the forecast period.
Surface Mounting to Hold Largest Market Share
Surface mounting, also known as chip bonding, accounts for close to 40% of the total market share in the Asia-Pacific electronics industry. The major types of adhesives used in this application include mostly one-component systems, made from acrylics, epoxies, or urethane acrylates, and can be either electrically or thermally conductive. These adhesives used have superior physical and chemical quality which helps them to have a long shelf life, a high wet strength, rapid curing, strength, and flexibility.
Companies Mentioned:
BASF SE ,Covestro AG,3M Company,Bostik SA ,Avery Dennison Corporation ,Dow Chemical Company ,Adco Global Inc. ,Sika AG,Ashland Inc,Illinois Tool Works Inc. ,H.B. Fuller Company ,Rpm International Inc. ,Adhesives Research Inc. ,Beardow & Adams (Adhesives) Ltd ,Chemence Inc.,Henkel Ag & Company, KGAA,Huntsman Corporation ,Pidilite Industries ,Mapei SPA ,Super Glue Corporation ,Heng Ying Adhesive Co., Ltd ,Ninghai Dingcheng Adhesive Co., Ltd. ,American Biltrite, Inc.
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Key Developments
September 2017: H.B. Fuller Company acquired Royal Adhesives and Sealants
August 2016: Adhesives division of Alfagres S.A. was acquired by Henkel AG & Co. KGaA
Major Players: Henkel, DowDupont, H.B. Fuller Company, and 3M, amongst others.
Reasons to Purchase this Report
To understand the impact of increasing stringent regulations on the market
Analyzing various perspectives of the market with the help of Porter’s five forces analysis
To understand the dominating resin type in the market
To identify the countries that are expected to witness the fastest growth during the forecast period
Identify the latest developments, market shares, and strategies employed by the major market players
3-month analyst support, along with the Market Estimate sheet (in Excel)
Customization of the Report
This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
Browse Full Report @ http://orbisresearch.com/reports/index/asia-pacific-electronics-adhesives-market-segmented-by-resin-type-application-and-geography-growth-trends-and-forecast-2018-2023
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Orbis Research
Hector Costello
+1 (214) 884-6817
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Source: EmailWire.Com 
Source: EmailWire.com
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