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 (EMAILWIRE.COM, April 12, 2019 ) Convergence of electronics and automotive industry driving the quest for semiconductor manufacturing. The sales of semi-conductors is largely influenced by numerous economic and non-economic factors. The sales pattern for semiconductors have faced similar ups and downs as the global economy. Therefore, the global economy plays a key role in the development of semiconductor market. Amongst the non-economic factors, application markets influence their sales. Data processing, consumer electronics, communications, automobile and industrial sectors are the application markets for semiconductors.
The global semiconductor manufacturing equipment market accounted to US$ 62.10 Bn in 2018 and is expected to grow at a CAGR of 5.2% during the forecast period 2019 - 2027, to account to US$ 101.58 Bn by 2027.
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The major companies operating in the global market
Advantest Corporation
Applied Materials, Inc.
ASML Holding N.V.
Hitachi High-Technologies Corporation
KLA Corporation
Lam Research Corporation
Rudolph Technologies, Inc.
Screen Holdings Co., Ltd.
Teradyne Inc.
Tokyo Electron Ltd
Potentially, automotive and industrial sectors present larger opportunities as compared to other sectors due to the volumetric implementations of semiconductors and subsequently drive the demands for semiconductor manufacturing equipment. The development of smart cars and connected cars presents huge potentials for semiconductor industry. In the recent times, researches in the automobile domain have laid huge emphasis on increasing the rider as well as passenger comfort and safety in the cars during driving.
Semiconductor packaging forms an integral and important part of the semiconductor manufacturing process. IC packaging is important as the semiconductor industry faces constant trade-offs between the performance of the devices and reducing the IC footprints. Advanced packaging techniques ensure longer battery life, higher performance, and integration of multi-functionalities while reducing the IC footprint integrated into any electronics device. The emerging packaging techniques being employed in the semiconductor manufacturing process today include 2.5D & 3D packaging through the technology Through Silicon Vias (TSV), Wafer Level packaging Technologies, and Fan-in as well as Fan-out technologies at the panel level. Furthermore, redistribution layer material (RDL) is used in these advanced semiconductor packaging technologies to maintain proper conductivity in the circuit and enhance the functioning between the I/O pads and IC.
The global semiconductor manufacturing equipment market by equipment type is segmented in to Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment, and Others. Semiconductor fabrication needs a manufacturing equipment in a clean room for the fabrication of semiconductors, an equipment to test semiconductors, and related support facilities required at the fabrication facility.
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The Insight Partners
Sameer Joshi
+1-646-491-9876
sam@theinsightpartners.com 
Source: EmailWire.com
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